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Автор: Xing-Chang Wei
Название: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Издательство: CRC Press
Год: 2017
ISBN: 9781138033566
Язык: English
Формат: pdf
Размер: 12,6 mb
Страниц: 340
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network.
This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.
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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging 
